Asia’s largest International Assembly and Circuit Board Seminar (IMPACT Seminar) will be held grandly in Nangang from October 21st to 24th. It will celebrate its 20th anniversary and be bigger than ever. At the same time, the TPCA Show will also be...
Asia’s largest International Assembly and Circuit Board Seminar (IMPACT Seminar) will be held grandly in Nangang from October 21st to 24th. It will celebrate its 20th anniversary and be bigger than ever. At the same time, the TPCA Show will also be on display from October 22 to 24.
This year's exhibition is themed "Energy-Efficient AI: From Cloud to Edge", focusing on the technical challenges and opportunities brought about by the expansion of AI applications from large data centers to edge devices, highlighting the key roles of semiconductor packaging, PCB, IC carrier boards and advanced technologies in high-performance, low-power solutions, and demonstrating Taiwan's leading position as a global semiconductor packaging and circuit board center.
Looking at the major trends in AI on the first day of the opening, TSMC × AWS × Intel lead the wayA grand opening ceremony will be held at the Hi-Lai Hotel in Taipei on the morning of October 21. The keynote speeches will be led by three industry giants: Dr. Frank Lee, deputy general manager of TSMC, will explain how to achieve energy-efficient computing and promote sustainable AI construction through advanced manufacturing processes, 3D integration and packaging technologies such as CoWoS and InFO; Dr. Babak Sabi, deputy general manager of AWS, will discuss AI The packaging and system challenges faced by data centers under rapid growth and proposed response strategies; Intel Vice President Jatin Upadhyay will share data center architecture innovations, covering memory technology, high-speed interconnection, power and thermal management, and software facilities. The three leaders will work together to outline the future blueprint for AI energy efficiency, packaging technology and system architecture.
The keynote speeches starting from the next day will be Dr. Takao Iwaki, director of Mirise Technologies, a joint venture between Japan's TOYOTA and Denso, to discuss the chiplets and SoC solutions required for advanced driver assistance systems (ADAS); and Dr. Sung Jin Kim, chief technology officer of Absolics, a glass substrate manufacturer owned by South Korea's SKC, will analyze the next generation of innovative technologies and the opportunities and challenges of glass substrates.
Heterogeneous integration × glass substrate × advanced packaging: full analysis of 40+ technology forums in three daysThe three-day forum covers more than 40 topics. Global benchmark companies such as AMD, Applied Materials, ASE, Intel, Lam Research, MKS’Atotech, Qnity™, DuPont Electronics, SPIL, etc. will gather in Taipei to focus on forward-looking technology topics such as AI, heterogeneous integration, glass substrates, advanced packaging and carrier boards. There are also special technical sessions on JIEP, ICEP and ISMP from Japan and South Korea, providing first-hand international perspectives. This year, it also cooperated with TPCA Show for the first time in Open Seminar. Applied Materials, Reconac, Sony, international market research agency Yole and expert Wu Lingxiang jointly analyzed the latest market trends, while the SMTA Forum focused on advanced packaging and circuit board technology, inviting authoritative experts at home and abroad to conduct in-depth analysis.
The glory of the 20th anniversary reappears, the industry-university-research exchange platform leads the new era of AI and semiconductorsAfter 20 years, IMPACT has always adhered to the original intention of "promoting an international exchange platform for global packaging and PCB industry-academia advanced technologies" and has witnessed the glorious moments of Taiwan's semiconductor and PCB industries. Sensing the importance of human talent as national strength, this year's 20th anniversary has launched a "Student Exclusive Triple Surprise" to expand the invitation to young students to learn about industry prospects at the event. In addition, two heavyweight lecturers from Yang Ming Jiaotong University and the National University of Singapore will be invited to the master lecture on 10/23 to deeply explore the future trends of advanced packaging and plan industry-university matchmaking to help students connect with the industry in advance, grasp employment opportunities, and prepare exclusive gifts, bringing a triple experience of learning, exchange and employment. In addition, the conference also launched the 20 Legacy series of events, inviting global industry elites and new generation talents to gather in Nangang to jointly embrace the new future of the AI technology wave!
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